How to remove solder from the circuit board using a reflow oven

The circuit board reflow machine can remove solder from the circuit board. The specific steps are as follows:

1. Place the circuit board on the reflow machine and set the temperature to the desired level. Different circuit boards and solder require different temperatures. Generally, the melting point of solder is between 183°C and 217°C. It is recommended to set the temperature around 200°C.
2. Wait for the reflow machine to reach the desired temperature, which usually takes a few minutes.
3. Use desoldering wick or a desoldering pump to remove the liquid solder from the circuit board. When using this method, be careful not to touch other components. It is best to suction the solder to a blank area.
4. After removing the solder from the circuit board, clean the board with alcohol or other cleaning agents to remove any remaining dirt and chemicals.

It is important to note that during the solder removal process with the reflow machine, safety precautions must be taken to prevent personal burns or damage to the circuit board. Protective gloves, masks, and goggles should be used as safety equipment.